AMB (Active Metal Brazed) Aluminum Nitride Substrate｜High Strength for Harsh Environments
Thick-Film Ceramic Substrate with Custom Circuit Design｜For Sensor & LED Packaging
Low-Temperature Co-Fired Ceramic (LTCC) Substrate｜Multilayer Structure for RF Modules
Direct Bonded Copper (DBC) Ceramic Substrate｜For High-Power Semiconductor Applications
High-Purity Alumina (Al₂O₃) Ceramic Substrate｜Excellent Electrical Insulation & Heat Resistance
Thin-Film Ceramic PCB｜Precision Circuit Patterning on Alumina or AlN