Foreign trade company Company focuses on high-performance silicon nitride, aluminum nitride ceramic substrate, research and development, production, sales and service as one, core equipment independent research and development, equipment process and material process integration, and can quickly make process adjustments according to customer feedback and customized needs.
Our Si3N4 products, with high strength, high toughness, high thermal conductivity, high reliability, based on these characteristics, products are widely used in the field of power semiconductor substrates requiring high reliability materials.
Thermal conductivity ≥85W/m⋅K
Instant firing process：strength up to 890Mpa
Number of thermal shock resistance≥5000 times
Surface roughness Ra：Grinding process -0.5um, Instant firing process-0.5 um or less
Applications: Circuit substrate (DBC, DPC, AMB, DBA, thick film, thin film), heat spreader.
