Продукция

AMB (Active Metal Brazed) Aluminum Nitride Substrate｜High Strength for Harsh Environments

Thick-Film Ceramic Substrate with Custom Circuit Design｜For Sensor & LED Packaging

Low-Temperature Co-Fired Ceramic (LTCC) Substrate｜Multilayer Structure for RF Modules

Direct Bonded Copper (DBC) Ceramic Substrate｜For High-Power Semiconductor Applications

High-Purity Alumina (Al₂O₃) Ceramic Substrate｜Excellent Electrical Insulation & Heat Resistance

Thin-Film Ceramic PCB｜Precision Circuit Patterning on Alumina or AlN